$12.00
Water-based adhesive for Spring Sponge rubbers with stronger bonding and easy cleanup.
The Butterfly Free Chack II is a water-based adhesive formulated specifically for Spring Sponge rubbers, including SpinArt and the Tenergy series. It delivers a stronger bond than the original Free Chack while remaining easy to apply and adjust.
One of the key advantages of this glue is how cleanly it works. Excess adhesive can be easily removed from both the sponge surface and your blade, making application straightforward and mess-free. This is particularly useful when you need to reposition your rubber or remove it for cleaning or replacement.
If you use Spring Sponge rubbers like SpinArt or Tenergy, the Free Chack II is engineered to give you reliable adhesion with minimal fuss during setup and maintenance.
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